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| DATA SHEET MOS INTEGRATED CIRCUIT PD4711B RS-232 LINE DRIVER/RECEIVER The PD4711B is a high-voltage silicon gate CMOS line driver/reciever conforming to the EIA/TIA-232-E standard. It can operate with a single +5 V power source because it is provided with a DC-DC converter. In addition, this line driver/receiver has many ancillary functions, including output control, threshold select, and standby functions. Because the PD4711B is provided with two output driver circuits and two receiver circuits, it can constitute an RS232 interface circuit with a single chip. FEATURES * Conforms to EIA/TIA-232-E (RS-232C) standard * +5 V single power source * Threshold select pin selecting two types of threshold voltages * Standby mode can be set by making standby pin high to reduce circuit current. * Three-state output configuration. Both driver and receiver outputs go into high-impedance state in standby mode. ORDERING INFORMATION Part Number Package 20-pin plastic DIP (300 mil) 20-pin plastic SOP (300 mil) PD4711BCX PD4711BGS The information in this document is subject to change without notice. Document No. S10315EJ3V1DS00 (3rd edition) Date Published April 1997 N Printed in Japan (c) 1995 PD4711B BLOCK DIAGRAM/PIN CONFIGURATION (Top View) +10 V + C3 1 VDD C1 + DC - DC converter C4 + 20 + C4 2 C1 + 3 4 +5 V By pass Capacitor Standby STBY 5 GND 19 + C2 C4 - VCC C1 - 18 VSS 17 16 300 15 300 14 13 5.5 k 12 5.5 k 11 -10 V DCON DOUT1 DOUT2 RIN1 RIN2 RCON Threshold control Output contrtol TTL/CMOS INPUT DIN1 DIN2 6 7 RS-232 OUTPUT TTL/CMOS OUTPUT ROUT1 8 ROUT2 9 10 GND RS-232 INPUT * VDD and Vss are output pins of voltages internally boosted. Connecting a load directly to these pins is not recommended. ** The standby pin is internally pulled down. *** Use capacitors with a working voltage of 16 V or higher as C1 through C4. Insert a bypass capasitor about 0.1 to 1 F between VCC pin to GND pin. 2 PD4711B TRUTH TABLE Drivers STBY H L L L DCON X L H H DIN X X L H DOUT Z L H L Remark Standby mode (DC-DC converter stops) Mark level output Space level output Mark level output Receivers STBY H L L RIN X L H ROUT Z H L Remark Stanby mode (DC-DC converter stops) Mark level input Space level input Receiver input threshold voltage RCON L H RIN1 to RIN2 A mode B mode H: high level, L: low level, Z: high impedance, X: H or L 3 PD4711B ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Parameter Supply voltage Driver input voltage Receiver input voltage Driver output voltage Receiver output voltage Receiver input current Operating temperature range Storage temperature range Power dissipation Symbol VCC DIN RIN DOUT ROUT IIN TA Tstg PT Ratings -0.5 to +6.0 -0.5 to VCC +0.5 -30.0 to +30.0 -25.0 to +25.0Note 1 -0.5 to VCC + 0.5 60.0 -40 to +85 -55 to +150 0.5 Unit V V V V V mA C C W Note 1. Pulse width: 1 ms, duty factor: 10 % MAX. RECOMMENDED OPERATING RANGE Parameter Supply voltage Receiver input voltage Operating temperature range External capacitance Symbol MIN. 4.5 -30 -20 1.0 22 TYP. 5.0 MAX. 5.5 +30 80 47 Unit V V C VCC RIN TA Note 2 F Note 2. The capacitance of an electrolytic capacitor decreases at a low temperature (0 C or lower). Determine the capacitance of the capacitor to be used taking this into consideration when the PD4711B is used at a low temperature. Keep the wiring length between the capacitor and IC as short as possible. ELECTRICAL CHARACTERISTICS (OVERALL) (Unless otherwise specified, VCC = +5 V 10 %, TA = -20 C to +80 C, C1 to C4 = 22 F) Parameter Circuit current ICC1 Circuit current ICC2 Standby circuit current ICC (Standby) Standby low-level input voltage Standby high-level input voltage Input capacitance VIL (Standby) VIH (Standby) CIN Driver input and receiver input VCC = +5 V, vs. GND, f = 1 MHz 10 pF 2.0 V Symbol Conditions VCC = +5 V, no load, RIN pin open (Standby pin open) VCC = +5 V, RL = 3 k (DOUT), DIN = GND, RIN and ROUT pins open (Standby pin open) VCC = +5 V, no load, RIN pin open (Standby pin high) Note 3 0.8 V 50 120 15.0 25.0 mA 4.5 9.0 mA MIN. TYP. MAX. Unit A * TYP.: Typical (reference) value at TA = 25 C. Note 3. Because the standby pin is internally pulled down, if the standby pin is left open, operating mode is in effect. 4 PD4711B ELECTRICAL CHARACTERISTICS (DRIVER) (Unless otherwise specified, VCC = +5 V 10 %, TA = -20 C to +80 C, C1 to C4 = 22 F) Parameter Low-level input voltage High-level input voltage Low-level input current High-level input current Output voltage VDO Symbol VIL VIH IIL IIH VCC = +5.0 V, RL = , TA = 25 C VCC = +5.0 V, RL = 3 k VCC = +4.5 V, RL = 3 k Output short current Slew rate SR Propagation delay timeNote 4 tPHL tPLH Output resistance RO Standby output transition time Standby output transition time tDAZ tDZA RL = 3.5 k, CL = 2500 pF VCC = VDD = VSS = 0 V VOUT = 2 V Note 5 Note 5 300 4 25 10 50 0.8 ISC VCC = +5.0 V, vs. GND CL = 10 pF, RL = 3 to 7 k CL = 2500 pF, RL = 3 to 7 k 1.5 1.5 5.5 5.0 15 11 6 40 30 30 2.0 0 0 9.7 -1.0 1.0 Conditions MIN. TYP. MAX. 0.8 Unit V V A A V V V mA V/s V/s s s ms * TYP.: Typical (reference) value at TA = 25 C. Note 4. Test point If the output control pin is made low, the driver output goes low regardless of the driver input state. 6 ns 6 ns 5 Driver input 0 90 % 1.5 V 10 % 10 % tPHL VOH Driver output 90 % 1.5 V tPLH 3V -3 V 90 % 3V -3 V VOL 10 % SR SR 5 PD4711B Note 5. Test Point 5V Standby input 0V 1.5 V 1.5 V VOH Driver output VOL +5 V High impedance -5 V +5 V -5 V tDAZ tDZA Do not perform communication within the standby output transition time tDZA on power application or on releasing the standby mode. ELECTRICAL CHARACTERISTICS (RECEIVER) (Unless otherwise specified, VCC = +5 V 10 %, TA = -20 C to +80 C, C1 to C4 = 22 F) Parameter Low-level output voltage High-level output voltage Symbol VOL VOH VIL VIH tPHL tPLH Input current Input resistance Input pin release voltage Input threshold A mode (RCON pin low) IIN RI VIO VIH VIL VH Input threshold B mode (RCON pin high) VIH VIL VH Standby output transition time Standby output transition time tDAZ tDZA RL = 1 k, CL = 150 pF VIN = 5 V VIN = 3 to 25 Input threshold A mode only VCC = +5 V VCC = +5 V VCC = +5 V (hysteresis width) VCC = +5 V VCC = +5 V VCC = +5 V (hysteresis width) Note 7 Note 7 1.6 0.6 0.5 1.6 -0.4 2.6 2.2 1 1.2 2.2 -1.8 4.0 0.4 0.03 3 0.13 1 5 7 0.5 2.6 1.6 1.8 2.6 -3.0 5.4 1 10 IOUT = 4 mA IOUT = -4 mA RCON pin RCON pin 2.0 VCC -0.8 Low-level input voltage High-level input voltage Propagation delay timeNote 6 0.8 V V Conditions MIN. TYP. MAX. 0.4 Unit V V s mA k V V V V V V V s ms * TYP.: Typical (reference) value at TA = 25 C. 6 PD4711B Note 6. Test Point 10 ns 10 ns 5 Receiver input -5 90 % 1.5 V 10 % 10 % 90 % 1.5 V tPHL tPLH VOH Receiver output 1.5 V VOL 1.5 V Note 7. Test Point 5V Standby input 0V 1.5 V 1.5 V VOH Receiver output VOL 90 % High impedance 10 % tDAZ tDZA The receiver output is undefined during the standby output transition time tDZA. Do not perform communication in the standby output transition time tDZA on power application or on releasing the standby mode. 7 PD4711B TEST CIRCUIT Driver output voltage/Output current (+ side) +10 V + C3 1 VDD C1 + DC - DC converter C4 + 20 + C4 2 C1 + 3 4 +5 V 5 6 GND 19 + C2 C4 - VCC C1 - 18 +5 V VSS 17 16 300 15 300 14 13 5.5 k -10 V STBY 7 8 9 5.5 k 10 GND IDO 12 11 V V DO Driver output voltage/Output current (- side) +10 V + C3 1 VDD C1 + DC - DC converter C4 + 20 + C4 2 C1 + 3 4 +5 V 5 6 GND 19 + C2 C4 - VCC C1 - 18 +5 V VSS 17 16 300 15 300 14 13 5.5 k -10 V STBY 7 8 9 5.5 k 10 GND IDO 12 11 V V DO 8 PD4711B PACKAGE DRAWINGS 20PIN PLASTIC DIP (300 mil) 20 11 1 A I 10 K P L J H G F B D N M C M R NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS A B C D F G H I J K L M N P R 25.40 MAX. 1.27 MAX. 2.54 (T.P.) 0.500.10 1.1 MIN. 3.50.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 7.62 (T.P.) 6.4 0.25 +0.10 -0.05 0.25 0.9 MIN. 0~15 INCHES 1.000 MAX. 0.050 MAX. 0.100 (T.P.) 0.020 +0.004 -0.005 0.043 MIN. 0.1380.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.300 (T.P.) 0.252 0.010 +0.004 -0.003 0.01 0.035 MIN. 0~15 P20C-100-300A,C-1 9 PD4711B 20 PIN PLASTIC SOP (300 mil) 20 11 detail of lead end 1 A 10 H G P I J F K E C D NOTE N M M B L ITEM MILLIMETERS A B C D E F G H I J K L M N P 13.00 MAX. 0.78 MAX. 1.27 (T.P.) 0.40 +0.10 -0.05 0.10.1 1.8 MAX. 1.55 7.70.3 5.6 1.1 0.20 +0.10 -0.05 0.60.2 0.12 0.10 3 +7 -3 INCHES 0.512 MAX. 0.031 MAX. 0.050 (T.P.) 0.016 +0.004 -0.003 0.0040.004 0.071 MAX. 0.061 0.3030.012 0.220 0.043 0.008 +0.004 -0.002 0.024 +0.008 -0.009 0.005 0.004 3 +7 -3 Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. P20GM-50-300B, C-4 10 PD4711B RECOMMENDED SOLDERING CONDITIONS Soldering the PD4711B under the conditions listed in the table below is recommended. For soldering methods and conditions other than those recommended, consult NEC. Surface mount type For the details of the recommended soldering conditions of the surface mount type, refer to Information document "Semiconductor Device Mounting Technology Manual" C10535EJ7V0IF00. PD4711BGS Soldering Method Infrared reflow Soldering Condition Package peak temperature: 235 C, Time: 30 seconds MAX. (210 C MIN.), Number of times: 2, Number of days: not limited* VPS Package peak temperature: 215 C, Time: 40 seconds MAX. (200 C MIN.), Number of times: 2, Number of days: not limited* Wave soldering Soldering bath temperature: 260 C MAX., Time: 10 seconds MAX., Number of times: 1, Number of days: not limited* Pin partial heating Pin temperature: 300 C MAX (lead temperature), Time: 3 seconds MAX. (per lead pin), Number of days: not limited* WS60-00-1 VP15-00-2 Recommended Condition Symbol IR35-00-2 * The number of days the device can be stored at 25 C, 65 % RH MAX. after the dry pack has been opened. Caution Do not use two or more soldering methods in combination (except the pin partial heating method). Throught-hole type PD4711BCX Soldering Method Wave soldering Soldering Conditions Soldering bath temperature: 260 C MAX., Time: 10 seconds MAX. Reference documents "NEC Semiconductor Device Reliability/Quality Control System" (IEI-1212) "Quality Grade on NEC Semiconductor Devices" (IEI-1209) "Semiconductor Device Mounting Technology Manual" C10535EJ7V0IF00 11 PD4711B [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 12 |
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